The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
A resistência de contato da galvanoplastia de ouro endurecido com níquel (NiHG) depositada em cupons de disco de bronze fosforoso revestidos com níquel (substrato) após o envelhecimento térmico foi medida com uma sonda de pino de liga de cobre-berílio banhada a ouro duro por meio de uma técnica de sonda de quatro pontos, em comparação com o da galvanoplastia de ouro endurecido com cobalto (CoHG). A superfície dos cupons revestidos com NiHG após o envelhecimento foi analisada por espectroscopia de fotoelétrons de raios X (XPS) para investigar a influência da formação do filme de óxido durante o envelhecimento térmico na resistência de contato da eletroplaca NiHG, em comparação com a do CoHG. A resistência de contato inicial dos cupons de NiHG foi inferior a 10 mΩ com forças de contato superiores a 0.05 N, aumentada para 10 mΩ com uma força de contato de 0.05 N após 100 horas de envelhecimento a 200
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Copiar
Hisao KUMAKURA, Makoto SEKIGUCHI, "Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --" in IEICE TRANSACTIONS on Electronics,
vol. E82-C, no. 1, pp. 13-18, January 1999, doi: .
Abstract: Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_1_13/_p
Copiar
@ARTICLE{e82-c_1_13,
author={Hisao KUMAKURA, Makoto SEKIGUCHI, },
journal={IEICE TRANSACTIONS on Electronics},
title={Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --},
year={1999},
volume={E82-C},
number={1},
pages={13-18},
abstract={Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
keywords={},
doi={},
ISSN={},
month={January},}
Copiar
TY - JOUR
TI - Increase in Contact Resistance of Hard Gold Plating during Thermal Aging -- Nickel-Hardened Gold and Cobalt-Hardened Gold --
T2 - IEICE TRANSACTIONS on Electronics
SP - 13
EP - 18
AU - Hisao KUMAKURA
AU - Makoto SEKIGUCHI
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 1999
AB - Contact resistance of nickel hardened gold electroplate (NiHG) deposited on nickel-underplated phosphor bronze disk coupons (substrate) after thermal aging was measured with a hard gold-plated beryllium copper alloy pin probe by means of a four-point probe technique, compared to that of cobalt-hardened gold electroplate (CoHG). Surface of NiHG plated coupons after aging was analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the influence of the oxide film formation during thermal aging on contact resistance of NiHG electroplate, compared to that of CoHG. Initial contact resistance of the NiHG coupons was less than 10 mΩ at a contact forces more than 0.05 N, increased to 10 mΩ at a contact force of 0.05 N after 100 hours aging at 200
ER -