The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Este artigo relata o uso de estruturas de teste microeletrônicas para caracterizar uma nova técnica de fabricação de placas de circuitos eletrônicos de filme fino. Nesta tecnologia, as trilhas de circuito são formadas em substratos semelhantes a papel, depositando filmes de tinta carregada de metal por meio de um processo de impressão litográfica padrão. A resistência da folha e a largura de linha para linhas horizontais e verticais são avaliadas eletricamente e comparadas com medições de perfil óptico e de superfície.
Anthony J. WALTON
J. Tom M. STEVENSON
Leslie I. HAWORTH
Martin FALLON
Peter S. A. EVANS
Blue J. RAMSEY
David HARRISON
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Anthony J. WALTON, J. Tom M. STEVENSON, Leslie I. HAWORTH, Martin FALLON, Peter S. A. EVANS, Blue J. RAMSEY, David HARRISON, "Characterisation of Offset Lithographic Films Using Microelectronic Test Structures" in IEICE TRANSACTIONS on Electronics,
vol. E82-C, no. 4, pp. 576-581, April 1999, doi: .
Abstract: This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_4_576/_p
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@ARTICLE{e82-c_4_576,
author={Anthony J. WALTON, J. Tom M. STEVENSON, Leslie I. HAWORTH, Martin FALLON, Peter S. A. EVANS, Blue J. RAMSEY, David HARRISON, },
journal={IEICE TRANSACTIONS on Electronics},
title={Characterisation of Offset Lithographic Films Using Microelectronic Test Structures},
year={1999},
volume={E82-C},
number={4},
pages={576-581},
abstract={This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.},
keywords={},
doi={},
ISSN={},
month={April},}
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TY - JOUR
TI - Characterisation of Offset Lithographic Films Using Microelectronic Test Structures
T2 - IEICE TRANSACTIONS on Electronics
SP - 576
EP - 581
AU - Anthony J. WALTON
AU - J. Tom M. STEVENSON
AU - Leslie I. HAWORTH
AU - Martin FALLON
AU - Peter S. A. EVANS
AU - Blue J. RAMSEY
AU - David HARRISON
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 1999
AB - This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.
ER -