The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
A hierarquia de embalagens não é uma estrutura fixa. Pode ser alterado dependendo da própria tecnologia de embalagem, e o número de níveis de hierarquia tende a diminuir. Na tecnologia de pacotes LSI, incluindo interconexões pacote-placa, ocorreram duas mudanças evolutivas. A primeira evolução foi de PTH para SMT, e a segunda evolução foi de “Conexões periféricas” para “Conexões de matriz de área”. Essas evoluções foram causadas pela integração de ICs e requisitos de produtos de aplicação. Agora, a terceira evolução parece estar em andamento, que é de SCP para MCP ou SIP. Embora o SoC tenha muitas características notáveis, ele não foi aplicado em muitos sistemas, contrariamente às expectativas, e suas limitações ou problemas tornaram-se claros. SIP é a resposta para os problemas acima do SoC. O MCP pode ser considerado um SIP primitivo. O objetivo do MCP é preencher a lacuna tecnológica entre SMT e SoC para resolver os problemas. As metas do SIP são principalmente os próximos dois itens. (1) Superação da crise de interconexão do SoC. (2) Abertura de novos campos de aplicação em eletrônica. Para atingir essas metas, vários consórcios no mundo estão pesquisando e desenvolvendo tecnologias essenciais.
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Akihiro DOHYA, "Packaging Technology Trends and Challenges for System-in-Package" in IEICE TRANSACTIONS on Electronics,
vol. E84-C, no. 12, pp. 1756-1762, December 2001, doi: .
Abstract: The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e84-c_12_1756/_p
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@ARTICLE{e84-c_12_1756,
author={Akihiro DOHYA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Packaging Technology Trends and Challenges for System-in-Package},
year={2001},
volume={E84-C},
number={12},
pages={1756-1762},
abstract={The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.},
keywords={},
doi={},
ISSN={},
month={December},}
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TY - JOUR
TI - Packaging Technology Trends and Challenges for System-in-Package
T2 - IEICE TRANSACTIONS on Electronics
SP - 1756
EP - 1762
AU - Akihiro DOHYA
PY - 2001
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E84-C
IS - 12
JA - IEICE TRANSACTIONS on Electronics
Y1 - December 2001
AB - The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.
ER -