The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Exibições de texto completo
87
A Ethernet tornou-se uma tecnologia indispensável para comunicações e passou a ser usada em muitas aplicações. No IEEE, a padronização de alta velocidade tem sido discutida e tem visto a adoção de novas tecnologias, como formatos de modulação multinível, modulação de alta taxa de transmissão e multiplexação por divisão de comprimento de onda densa. O formato do transceptor MSA também foi discutido seguindo a padronização IEEE. Foi necessário que dispositivos ópticos como TOSA e ROSA se tornassem mais compactos e de maior velocidade, porque cada formato de transceptor precisa ser miniaturizado para construção de alta densidade. Apresentamos as tecnologias para a realização de 100GbE e aquelas aplicáveis a 400GbE. Também discutimos pacotes futuros para dispositivos ópticos. Existem muitas semelhanças entre pacotes de dispositivos ópticos e pacotes de dispositivos elétricos, e prevemos que os pacotes de dispositivos ópticos seguirão as tendências observadas em dispositivos elétricos. Mas também existem diferenças entre dispositivos ópticos e elétricos. É necessário utilizar novas tecnologias para questões ópticas específicas para empregar embalagens elétricas avançadas e acompanhar as tendências.
Hiroshi ARUGA
Mitsubishi Electric Corporation
Keita MOCHIZUKI
Mitsubishi Electric Corporation
Tadashi MURAO
Mitsubishi Electric Corporation
Mizuki SHIRAO
Mitsubishi Electric Corporation
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Copiar
Hiroshi ARUGA, Keita MOCHIZUKI, Tadashi MURAO, Mizuki SHIRAO, "Recent Progress with Next Generation High-Speed Ethernet Optical Device Technology" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 4, pp. 324-332, April 2019, doi: 10.1587/transele.2018ODP0001.
Abstract: Ethernet has become an indispensable technology for communications, and has come into use for many applications. At the IEEE, high-speed standardization has been discussed and has seen the adoption of new technologies such as multi-level modulation formats, high baud rate modulation and dense wave length division multiplexing. The MSA transceiver form factor has also been discussed following IEEE standardization. Optical devices such as TOSA and ROSA have been required to become more compact and higher-speed, because each transceiver form factor has to be miniaturized for high-density construction. We introduce the technologies for realizing 100GbE and those applicable to 400GbE. We also discuss future packages for optical devices. There are many similarities between optical device packages and electrical device packages, and we predict that optical device packages will follow the trends seen in electrical devices. But there are also differences between optical and electrical devices. It is necessary to utilize new technology for specific optical issues to employ advanced electrical packaging and catch up the trends.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018ODP0001/_p
Copiar
@ARTICLE{e102-c_4_324,
author={Hiroshi ARUGA, Keita MOCHIZUKI, Tadashi MURAO, Mizuki SHIRAO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Recent Progress with Next Generation High-Speed Ethernet Optical Device Technology},
year={2019},
volume={E102-C},
number={4},
pages={324-332},
abstract={Ethernet has become an indispensable technology for communications, and has come into use for many applications. At the IEEE, high-speed standardization has been discussed and has seen the adoption of new technologies such as multi-level modulation formats, high baud rate modulation and dense wave length division multiplexing. The MSA transceiver form factor has also been discussed following IEEE standardization. Optical devices such as TOSA and ROSA have been required to become more compact and higher-speed, because each transceiver form factor has to be miniaturized for high-density construction. We introduce the technologies for realizing 100GbE and those applicable to 400GbE. We also discuss future packages for optical devices. There are many similarities between optical device packages and electrical device packages, and we predict that optical device packages will follow the trends seen in electrical devices. But there are also differences between optical and electrical devices. It is necessary to utilize new technology for specific optical issues to employ advanced electrical packaging and catch up the trends.},
keywords={},
doi={10.1587/transele.2018ODP0001},
ISSN={1745-1353},
month={April},}
Copiar
TY - JOUR
TI - Recent Progress with Next Generation High-Speed Ethernet Optical Device Technology
T2 - IEICE TRANSACTIONS on Electronics
SP - 324
EP - 332
AU - Hiroshi ARUGA
AU - Keita MOCHIZUKI
AU - Tadashi MURAO
AU - Mizuki SHIRAO
PY - 2019
DO - 10.1587/transele.2018ODP0001
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 2019
AB - Ethernet has become an indispensable technology for communications, and has come into use for many applications. At the IEEE, high-speed standardization has been discussed and has seen the adoption of new technologies such as multi-level modulation formats, high baud rate modulation and dense wave length division multiplexing. The MSA transceiver form factor has also been discussed following IEEE standardization. Optical devices such as TOSA and ROSA have been required to become more compact and higher-speed, because each transceiver form factor has to be miniaturized for high-density construction. We introduce the technologies for realizing 100GbE and those applicable to 400GbE. We also discuss future packages for optical devices. There are many similarities between optical device packages and electrical device packages, and we predict that optical device packages will follow the trends seen in electrical devices. But there are also differences between optical and electrical devices. It is necessary to utilize new technology for specific optical issues to employ advanced electrical packaging and catch up the trends.
ER -