The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
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The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Neste trabalho, o pó de ouro feito de folha de ouro foi investigado como tendo potencial como enchimento de tinta condutora. A resistência de um filme condutor diminuiu de 6.2kΩ para 1 Ω adicionando apenas 2.0% em peso de pó de ouro à tinta de polímero condutor (PEDOT:PSS). A mudança da resistência depende das características do pó de ouro. Pó de ouro com tamanhos menores e uniformes e boa dispersibilidade é benéfico para formar uma rede de percolação contínua.
Sayaka YAMASHITA
Japan Advanced Institute of Science and Technology
Heisuke SAKAI
Japan Advanced Institute of Science and Technology
Hideyuki MURATA
Japan Advanced Institute of Science and Technology
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Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, "Application of Gold Powder Made from Gold Leaf for Conductive Inks" in IEICE TRANSACTIONS on Electronics,
vol. E102-C, no. 2, pp. 176-179, February 2019, doi: 10.1587/transele.2018OMS0009.
Abstract: In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018OMS0009/_p
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@ARTICLE{e102-c_2_176,
author={Sayaka YAMASHITA, Heisuke SAKAI, Hideyuki MURATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Application of Gold Powder Made from Gold Leaf for Conductive Inks},
year={2019},
volume={E102-C},
number={2},
pages={176-179},
abstract={In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.},
keywords={},
doi={10.1587/transele.2018OMS0009},
ISSN={1745-1353},
month={February},}
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TY - JOUR
TI - Application of Gold Powder Made from Gold Leaf for Conductive Inks
T2 - IEICE TRANSACTIONS on Electronics
SP - 176
EP - 179
AU - Sayaka YAMASHITA
AU - Heisuke SAKAI
AU - Hideyuki MURATA
PY - 2019
DO - 10.1587/transele.2018OMS0009
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 2019
AB - In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2kΩ to 1 Ω by adding only 2.0wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
ER -