The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. ex. Some numerals are expressed as "XNUMX".
Copyrights notice
The original paper is in English. Non-English content has been machine-translated and may contain typographical errors or mistranslations. Copyrights notice
Este artigo estuda o impacto do preenchimento fictício para a variação da capacitância induzida pelo polimento químico-mecânico (CMP) na inserção do buffer com base em um modelo virtual de estimativa de preenchimento CMP. Comparado com os métodos existentes, nosso algoritmo é mais viável ao realizar a inserção de buffer não no pós-processo, mas durante o projeto físico inicial. Nossas contribuições são triplas. Primeiro, introduzimos um algoritmo rápido aprimorado de estimativa de quantidade de preenchimento fictício baseado em [4] e usamos algumas técnicas de aceleração (mesclagem de blocos, fator de preenchimento e atribuição de quantidade) para estimativa inicial. Em segundo lugar, com base em algumas suposições razoáveis, apresentamos um método ótimo de preenchimento virtual para estimar a posição fictícia e o efeito na capacitância de interconexão. Em seguida, o modelo de estimativa de preenchimento fictício foi verificado por nossos experimentos. Terceiro, usamos este modelo na inserção inicial do buffer após a atribuição da camada, considerando os efeitos do preenchimento fictício. Resultados experimentais verificaram a necessidade de estimativa antecipada de preenchimento fictício e a validade do nosso algoritmo. A inserção de buffer considerando o preenchimento fictício durante o projeto físico inicial é necessária e nosso algoritmo é promissor.
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Copiar
Yanming JIA, Yici CAI, Xianlong HONG, "Dummy Fill Aware Buffer Insertion after Layer Assignment Based on an Effective Estimation Model" in IEICE TRANSACTIONS on Fundamentals,
vol. E91-A, no. 12, pp. 3783-3792, December 2008, doi: 10.1093/ietfec/e91-a.12.3783.
Abstract: This paper studies the impact of dummy fill for chemical mechanical polishing (CMP)-induced capacitance variation on buffer insertion based on a virtual CMP fill estimation model. Compared with existing methods, our algorithm is more feasible by performing buffer insertion not in post-process but during early physical design. Our contributions are threefold. First, we introduce an improved fast dummy fill amount estimation algorithm based on [4], and use some speedup techniques (tile merging, fill factor and amount assigning) for early estimation. Second, based on some reasonable assumptions, we present an optimum virtual dummy fill method to estimate dummy position and the effect on the interconnect capacitance. Then the dummy fill estimation model was verified by our experiments. Third, we use this model in early buffer insertion after layer assignment considering the effects of dummy fill. Experimental results verified the necessity of early dummy fill estimation and the validity of our algorithm. Buffer insertion considering dummy fill during early physical design is necessary and our algorithm is promising.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e91-a.12.3783/_p
Copiar
@ARTICLE{e91-a_12_3783,
author={Yanming JIA, Yici CAI, Xianlong HONG, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={Dummy Fill Aware Buffer Insertion after Layer Assignment Based on an Effective Estimation Model},
year={2008},
volume={E91-A},
number={12},
pages={3783-3792},
abstract={This paper studies the impact of dummy fill for chemical mechanical polishing (CMP)-induced capacitance variation on buffer insertion based on a virtual CMP fill estimation model. Compared with existing methods, our algorithm is more feasible by performing buffer insertion not in post-process but during early physical design. Our contributions are threefold. First, we introduce an improved fast dummy fill amount estimation algorithm based on [4], and use some speedup techniques (tile merging, fill factor and amount assigning) for early estimation. Second, based on some reasonable assumptions, we present an optimum virtual dummy fill method to estimate dummy position and the effect on the interconnect capacitance. Then the dummy fill estimation model was verified by our experiments. Third, we use this model in early buffer insertion after layer assignment considering the effects of dummy fill. Experimental results verified the necessity of early dummy fill estimation and the validity of our algorithm. Buffer insertion considering dummy fill during early physical design is necessary and our algorithm is promising.},
keywords={},
doi={10.1093/ietfec/e91-a.12.3783},
ISSN={1745-1337},
month={December},}
Copiar
TY - JOUR
TI - Dummy Fill Aware Buffer Insertion after Layer Assignment Based on an Effective Estimation Model
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 3783
EP - 3792
AU - Yanming JIA
AU - Yici CAI
AU - Xianlong HONG
PY - 2008
DO - 10.1093/ietfec/e91-a.12.3783
JO - IEICE TRANSACTIONS on Fundamentals
SN - 1745-1337
VL - E91-A
IS - 12
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - December 2008
AB - This paper studies the impact of dummy fill for chemical mechanical polishing (CMP)-induced capacitance variation on buffer insertion based on a virtual CMP fill estimation model. Compared with existing methods, our algorithm is more feasible by performing buffer insertion not in post-process but during early physical design. Our contributions are threefold. First, we introduce an improved fast dummy fill amount estimation algorithm based on [4], and use some speedup techniques (tile merging, fill factor and amount assigning) for early estimation. Second, based on some reasonable assumptions, we present an optimum virtual dummy fill method to estimate dummy position and the effect on the interconnect capacitance. Then the dummy fill estimation model was verified by our experiments. Third, we use this model in early buffer insertion after layer assignment considering the effects of dummy fill. Experimental results verified the necessity of early dummy fill estimation and the validity of our algorithm. Buffer insertion considering dummy fill during early physical design is necessary and our algorithm is promising.
ER -